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| Product Center >> Adhesive industry >> a Used for sealing, potting with bonding of small electronic components such as relays, buzzers, sensors, protectors, etc. used in electronics with electrical industries |
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| Category |
| One-component epoxy sealant
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| Characteristics |
| Low curing temperature, fast curing speed, easy operation, low viscosity, good fluidity, high bonding strength, temperature resistance, excellent electrical property, good resistance to acid and alkali
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| Scope of application |
| Used for sealing, potting and bonding of small electronic components such as relays, buzzers, sensors, protectors, etc. used in electronics and electrical industries
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| Product performance |
7101-033
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Properties
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Test
Conditions
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Unit
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Index
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Specific
gravity
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25¡æ
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g/cm3
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1.35¡À0.03
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Viscosity
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25¡æ£¬10rpm
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mPa¡¤s
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20000¡«30000
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25¡æ£¬1rpm
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mPa¡¤s
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30000¡«50000
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Curing
conditions
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-
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-
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100¡æ/50min
or 120¡æ/20min
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Hardness
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25¡æ
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Shore
D
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¡Ý85
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Glass
transition temperature
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DSC£¬10¡æ/Min
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¡æ
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¡Ý100
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Shear
adhesive strength
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Al-Al
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MPa
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¡Ý10.0
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Volume
resistance
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Normal
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¦¸¡¤m
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¡Ý1.0¡Á1013
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Dielectric
constant
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1MHz£¬25¡æ
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-
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4.1¡«4.7
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Electric
strength
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Normal
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MV/m
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¡Ý20
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